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Art:
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Events:
AI Impact Symposium
UIC CS William McCulloch Professor Mike Papka speaking at TEDxChicago 2024
Micheal E. Papka Honored with Warren S. McCulloch Professorships of Computer Science
University of Illinois Chicago Establishes a Center of Excellence focused on AI
Michael E. Papka Named EVL Director
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Research:
OAC Core: AIMCI: Artificial Intelligence for Managing Cyberinfrastructure
Tele-robotics to Tele-autonomous Robotics for Isotope Production
Enhancements to SciStream, a platform to enable memory-to-memory data streaming between federated instruments
NAIRR Pilot: A National-Scale Testbed Supporting Artificial Intelligence Research Spanning the Computing Continuum
Data Sharing and Analysis Across Leadership Computing Facilities
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Michael E. Papka
Director, EVL
EVL Faculty
Professor, Computer Science
MS Graduate, 1994
Electronic Visualization Laboratory, Computer Science Department
papka@uic.edu
https://www.evl.uic.edu/papka/
Bibliography
Leigh, J., Brown, M.D., DeFanti, T.A., Johnson, A.E., Long, L., Marai, G.E., Papka, M.E., Plepys, D.M., Renambot, L., Sandin, D.J., Talandis, J., Tsoupikova, D., Electronic Visualization Laboratory’s 50th Anniversary Retrospective: Look to the Future, Build on the Past,
Special Issue on Immersive Visualization Laboratories - Past, Present and Future
, vol 33, PRESENCE: Virtual and Augmented Reality, pp. 77–127, August 1, 2024
Papka, M.E., Brandt, L., Brynteson, H., Mirbod, P., Moradi Bilondi, A., Scapin, N., Effects of employing liquid-liquid emulsions on heat transfer within a turbulent Rayleigh-Benard convection,
APS Division of Fluid Dynamics
, Gallery of Fluid Motion, Washington, DC, November 19, 2023
Bode, M., Ferrier, N., Fischer, P., Göbbert, J.H., Insley, J.A., Lan, Y., Mateevitsi, V.A., Min, M., Papka, M.E., Patel, S., Rizzi, S., Windgassen, J., Scaling Computational Fluid Dynamics: In Situ Visualization of NekRS using SENSEI,
In Proceedings of the SC '23 Workshops of The International Conference on High Performance Computing, Network, Storage, and Analysis (SC-W '23)
, Association for Computing Machinery, pp. 862–867, November 12, 2023
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